Op dinsdag 15 mei 2001 13:47 schreef Fire69 het volgende:
Ben je van plan der nog extra te bestellen??
Ziet er wel deftig uit!
Ik heb er voor jouw ook eentje kunnen bestellen.
Dus in totaal 6 stuks ipv 5.
De website is weer vernieuwd. Er is een kleine vertraging van 1 tot 2 weken bijgekomen
"Incomming delivery date has been delayed as the die cast tool for base is being tested and certified. To eliminate any further delays I am having the base sections machined out of a single piece and this is currently in process. Most of the additional delay time is due to verification on my part that the fill in process did not degrade thermal performance or other features. Your patience to date has been appreciated, I have a man on - site overseeing the manufacturing and expediting the product for delivery. Starting the end of next week I will be recieving several hundred units a day until the current order backlog has been eliminated. In two weeks the ceramic die cast mold will be on line and production bottlenecks should be eliminated."
Maar, ze hebben ook een klein stukje geschreven over de clip:
"
Practical Design Limits
The selection of a socket mount over board mount was made after a careful consideration of the available options. As with most choices related to overclocking and cooling they become increasingly more extreme and costly as the power densities have increased to levels that are comparable to what you would see in a nuclear reactor or the friction heat generated by the space shuttle on re-entry. This has resulted in the use of over speed fans with their associated noise, large cumbersome heat sinks, exotic water and peltier systems to points of diminishing returns. As a heat sink design problem the trade-off decisions will determine the final design characteristics:
Maximum Airflow -
To achieve this in combination with tolerable noise levels we employed several patented aerodynamic technology features. In essence the design approach was to make the heat sink part of the fan rather than the fan as an add-on to the sink. This being a superior integration of the two components that results in a 2X thermal performance increase when homologous comparisons are made.
Minimum Volume -
In order to reach maximum performance while at the same time avoiding greatly exaggerated heat sink sizes and the potential for component interference. We elected the trade off of weight over volume with the choice of pure copper rather than aluminum (despite a doubling in manufacturing costs) to make our goal for the best thermal
performance in a reasonable package size. To aid in a compact product design, cutting edge manufacturing technologies were incorporated, such as ceramic die cast molds to handle the high heat loads associated with copper and high aspect fin ratios.
The added weight now leads us to the question of what to do about attachment to the CPU. What follows below is an outline of our design considerations for the end user:
Ease of Use -
The Board mount would have required us to increase the heat sink size/weight 50% to match the board mounting holes. A Board mount would have also required the removal
of the mother board. Then to sequentially torque 4 screws on a 3lb heat sink to approx.
20lbs force to a mating surface that essentially is a 1/2 sq. in of .020 thick glass. This is a daunting task for the accomplished mechanic let alone a casual one. There is also an heightened risk of damaging the CPU unless extreme care is taken. The socket attachment avoids these complications.
Cost -
Manufacturing a larger heat sink does not add significantly to performance at these C/W levels. But it does add significantly to the tooling, shipping, material & assembly costs.
So much in fact that the final manufacturing price would come close to equaling the current retail price.
With these considerations in mind the Socket mount was chosen as a lessor of the two evils and is described in more detail in the following discussion.
Glaciator Attachment Discussion
Some heat sink attachment solutions rely mostly on the clip pressure (CP Red) and the friction forces (F 1 & 2 Yellow) to hold the sink in place from the downward force (DF Dark Blue), or weight of the sink with some minor portion of the load distributed along the axis of the clip (Light Blue).
As noted in the AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794BOctober 2000 on page 17:
"Feature to Lock Relative Position of Heat sink, Clip, and Socket.
A locking feature is needed to avoid incorrect placement of the heat sink on the package. Such a lock can be constructed with small tabs that project from the sides of the clip and fit into a heat sink channel."
While the Glaciator can be held in place by friction forces alone we felt that more stability was required. This Locking "TAB" feature has been utilized in our heat sink application not only as a locating feature but as a support mechanism. The Tabs are extended between the fins and and as in the the diagram above a significant portion of the load is now transferred to the clip axis and socket rather than relying on friction forces to hold the sink in place. In a vertical position as depicted above the Tabs support the bulk of the weight. In a horizontal load condition the the weight is transferred directly to clip not the tabs.
From our drop test evaluation, it takes about 4 "G''s" (a drop of 3 to 4 ft.) to dislodge the sink and damage the socket. The Installation can survive casual moves about, but as a matter of safe practice I would strongly recommend the heat sink removal if you run the risk of banging it around, especially with any kind of car or truck transport. This is basically common sense and a precautionary measure, drop a hard drive or other sensitive component and you will confront the same issues.
A small percentage of users may encounter a problem with attachment if the socket lug "hook" (Fig. "A") Has been worn or damaged from frequent installation and removal of high force clips as shown in Figure "B". The "hook" may possibly be re-established with a needle or rifler file although the only solution may be replacing the socket or mother board.
"
Oftewel: ze gebruiken een clip, geen mobo-klemmen. Deze kan 4G hebben (1 meter laten vallen). Dus tillen en verslepen van de computer kan wel met heatsink erop, maar vervoeren in een auto kan niet.
Voor de mensen die het na willen lezen:
http://home.att.net/~millennium_thermal/Index.html
http://home.att.net/~millennium_thermal/Clip.html
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